4 Layer Rigid-Flex PCB

Layer: 4L

Base Material: FR4 TG180℃+PI

Board Thickness:

Rigid Area: 1.0±0.1mm;

Flex Area: 0.18±0.03mm

Final Copper Thickness: 18/35um

Base Copper Thickness: 0.5OZ

Surface Finished: ENIG

Unit Size(mm): 61.70*45.40

Min. W/S(mil): 5.9/5.9

Min. Hole Size: 0.2mm

Solder Mask: Green+Yellow coverlay