

Layer: 2L
Base Material: FR4(TG150℃)+FPC(PI 50um)
Board Thickness:
Rigid Area: 1.0±0.1mm;
Flex Area: 0.14±0.05mm
Final Copper Thickness: ≥1OZ
Surface Finished: ENIG
Unit Size(mm): 56.62*35.00
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay