

Special Request:
Double sided FPC+FR4 stiffener on bottom side+PI stiffener on top side(Back of finger)
Layer: 2L
Base Material: FPC(PI 50um)+FR4 Stiffener(TG150℃)+PI Stiffener
Board Thickness:
FPC+FR4 Stiffener: 1.6±0.16mm;
Pure FPC Area: 0.15±0.03mm;
FPC+PI Stiffener: 0.3±0.03mm
Final Copper Thickness: ≥28UM
Surface Finished: ENIG
Unit Size(mm): 63.80*194.10
Solder Mask: Yellow coverlay