

Layer: 2L
Base Material: FR4(TG150℃)+FPC
Board Thickness:
Rigid Area: 0.8±0.1mm;
Flex Area: 0.21±0.05mm
Final Copper Thickness: ≥35UM
Surface Finished: ENIG
Unit Size(mm): 79.05*82.07
Min. W/S(mil): 5.91/4.92
Min. Hole Size: 0.152mm
Solder Mask: Green+Yellow coverlay