Description
Layer: 2L
Base Material: FR4(TG150℃)+FPC
Board Thickness:
Rigid Area: 1.0±0.1mm;
Flex Area: 0.15±0.03mm
Final Copper Thickness: ≥35UM
Surface Finished: ENIG
Unit Size(mm): 64.14*184.84
Min. W/S(mil): 7.8/7.8
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay