Description
Blind&Buried Via
Layer : 6L
Base Material : FR4
Board Thickness : 0.8mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG
Unit Size(mm) : 24.71*24.71
Min Hole Size : 0.1mm
Min Hole Copper Thickness : 20um
Min W/S(mil) : 4.7/4.3
Solder Mask : Glossy Red
Special Process : Min. hole size 0.1mm0.25mm via plug with resign