Description
Layer : 16L
Base Material : TU-768
Board Thickness : 1.57±0.1mm
Final Copper Thickness: 20um
Surface Finished : ENIG+Golden Finger
Special Process : Via Plug with Resin, Cap Plating
Impedance Control
Single Impedance : 14 group
Differential Impedance : 13 group
Set Size : 266.7*139.71mm
Unit Size : 266.7*139.71mm
Min Hole Aperture : 0.2mm
Min Line Width : 3.5mil
Min Line Spacing : 4.3mil
Solder Mask Brand: LP-4G/R36
Solder Mask Color : Red