Layer: 8L
Base Material: FR4 TG150 CT1＞175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Gold Finger
Unit Size(mm): 120.0*78.0
Panel Size(mm): 120.0*78.0
Min W/S(mil): 8/8
Min Hole Size: 0.2mm
Solder Mask: Green Matt
