Description
Special Request:
1. Kapton tape
2. Designated IC positions require electroplating hole filling.
Layer: 4L
Base Material: FR4 IT-158
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 177.00*77.00
Min. W/S(mil): 5.51/5.9