Description
Special Request: Gold Finger
Layer: 2L
Base Material: FPC
Board Thickness: 0.30+/-0.05mm, connect finger pad area
Final Copper Thickness: 35UM
Surface Finished: ENIG
Unit Size(mm): 69.00*98.00
Min. W/S(mil): 27.56/9.5
Min. Hole Size: 0.35mm
Solder Mask: Yellow coverlay