Description
Special Request:
Application: Medical
Laser Blind Vias: L1-L2/L3-L4, Vias Plugged with Resin+Filling.
Layer: 4L
Base Material: FR4 TG170
Board Thickness: 0.4±0.1mm
Outer Layer Final Copper Thickness: ≥34.3UM
Inner Layer Final Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 20.08*23.91
Min. W/S(mil): 5.91/5.91
Min. Hole Size: 0.1mm