Description
Special Request:
2 Stiffiners on the top side per unit,
Total Board Thickness of Finger Area: 0.30±0.03mm
Layer: 2L
Base Material: FPC PI 25um
Board Thickness: 0.30mm±0.03mm(FPC+PI stiffiner)
Final Copper Thickness: 18UM
Surface Finished: ENIG
Unit Size(mm): 12.36*50.00
Min. W/S(mil): 4.7/4.37
Min. Hole Size: 0.15mm
Solder Mask: Yellow coverlay