Special Request:
1. Provide Ionic Contamination Reports;
2. Solder Mask Model: (Meikaimei) LE-600XZ.
Layer: 6L
Base Material: FR4
Board Thickness: 1.50mm
Outer Layer Final Copper Thickness: 78.7UM
Inner Layer Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 280.00*12.00
Min. Hole Size: 0.3mm
Solder Mask: White