Special Request:
1.Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness≥10um;
2. BOM&Twist≤0.7%.
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 35UM
Surface Finished: HASL Lead Free
Unit Size(mm): 54.38*54.38
Min. W/S(mil): 8/9.68