Description
Special Request:
1. Solder Mask Thickness on Copper Surface≥10um,
Solder Mask Thickness on Copper Edge≥5um;
2. BOM&Twist≤0.7%;
3. Vias Plugged with Resin+Copper Cap Plating of Filled Holes;
4. Metallised half slot, Press fit hole.
Layer: 4L
Base Material: FR4 TG180
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 20.00*79.40
Min. W/S(mil): 10/7.87