Special Request:
1. Outer Final Copper Thickness: Min. 52.9um;
2. Solder Mask Thickness: Min. 10um;
3. IPC-6012 Class 3.
Layer: 4L
Base Material: FR4 TG130
Board Thickness: 1.1mm
Final Copper Thickness: 2OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 101.20*33.75
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.2mm