Special Request:
1. Solder Mask Model: H-9100 8G,
Solder Mask Thickness≥10um;
2. Bow & Twist≤0.7%.
Layer: 4L
Base Material: FR4 (KB6160)
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: 35UM
Inner Layer Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 106.00*113.00
Min. W/S(mil): 5.98/6.96
Min. Hole Size: 0.2mm