Description
Special Request:
1. Solder Mask Thickness: Min. 10um;
2. Vias without solder mask openings on both sides need to be plugged;
Vias with double-sided solder mask openings.
Layer: 6L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 221.00*143.85
Min. W/S(mil): 5/5.9
Min. Hole Size: 0.3mm