Description
Special Request:
1. The thickness of hole copper plating on hole
minimum thin areas is 20um, average 25um;
2. Solder Mask Thickness: Min. 10um
Layer: 2L
Base Material: FR4
Board Thickness: 1.60mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Silver
Unit Size(mm): 40.64*23.75