Description
Special Request:
1. Solder Mask Ink Model: H-9100 8G,
Solder Mask Ink Thickness: ≥10um;
2. Coil Board, W/S: 6/6mil.
Layer: 2L
Base Material: FR4 TG130, CTI≥175
Board Thickness: 1.60mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 80.00*30.00
Min. W/S(mil): 6/6