Description
Special Request:
1. KB A grade yellow core base material;
2. Solder Mask Thickness on Copper Edge: Min. 10um,
Solder Mask Thickness on Copper Surface: 10-30um,
The base material position is not allowed to exceed 40um.
Layer: 2L
Base Material: FR4
Board Thickness: 1.60mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 77.55*108.51