Special Request:
1. Outer Final Copper Thickness: Min. 33.4um
2. BGA
Layer: 8L
Base Material: FR4 CTI≥175V
Board Thickness: 1.6mm
Surface Finished: ENIG+Impedance Control
Unit Size(mm): 70.00*158.00
Min. W/S(mil): 3.9/3.9
Min. Hole Size: 0.2mm
