Description
Special Request:
1. BGA
2. Solder Mask Ink Model: H-9100 44G
3. Impedance Control Board
4. Board Bending: Max. 5%
Layer: 2L
Base Material: FR4 TG≥135 KB6160
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 160.00*170.00
Min. W/S(mil): 4/4
Min. Hole Size: 0.3mm