Description
Special Request:
Solder Mask Ink Model: PM-500 WD-87SF,
Solder Mask Thickness on Copper Edge: Min. 10um.
Layer: 2L
Base Material: FR4 TG170
Board Thickness: 0.3mm
Final Copper Thickness: 18um
Surface Finished: ENIG
Unit Size(mm): 239.50*21.00
Min. W/S(mil): 10/11.6
Min. Hole Size: 0.2mm
Solder Mask: White