Description
Special Request:
1. Solder Mask Model: H-9100 8G,
Solder Mask Thickness≥10um;
2. Gold Thickness of ENIG: ≥2u",
Nickel Thickness: ≥118u".
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 15.40*15.00
Min. Hole Size: 0.3mm