Description
Special Request:
Solder Mask Model: H-9100 8G,
Solder Mask Thickness≥10um.
Layer: 4L
Base Material: FR4 TG150,CTI≥175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 85.00*45.00
Min. Hole Size: 0.3mm