Layer: 2L
Base Material: PI(CND2200MXI: 18Cu/20AD/50PI/20AD/18Cu)
Board Thickness: 0.25mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 233.51*147.28
Min. W/S(mil): 11.8/5.9
Min. Hole Size: 0.3mm
Solder Mask: Black Coverlay
