Description
Special Request:
1. L2/L3, L4/L5, L8/L9, L10/L11 Inner Copper Thickness≥11.4um;
L6/L7 Inner Copper Thickness≥24.9um;
2. Vias Plugged with Resin+Electroplate Flattened
Layer: 12L
Base Material: FR4 TG≥150
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 68.00*100.00
Min. W/S(mil): 3.5/3.5
Min. Hole Size: 0.2mm