Special Request:
1. Outer Layer Final Copper Thickness: Min. 52.9um;
2. Solder Mask Thickness: Min. 10um.
Layer: 4L
Base Material: FR4 TG170
Board Thickness: 1.57mm
Surface Finished: ENIG
Unit Size(mm): 95.25*234.95
Min. W/S(mil): 9.8/9.8
