Description
Special Request:
Solder Mask Thickness:
Solder Mask Thickness on Copper Edge: Min. 10um,
Solder Mask Thickness on Copper Surface: 10-30um,
Base material position cannot exceed 40um.
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 55.10*85.95
Min. W/S(mil): 9.8/9.8