Description
Special Request:
1. The inner layer has 2 kinds of copper thickness.
2. Solder Mask Thickness:
Solder Mask Thickness on Copper Edge: Min. 5um,
Solder Mask Thickness on Copper Surface: Min. 10um.
3. BGA
Layer: 10L
Base Material: FR4 TG150
Board Thickness: 1.62mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 68.00*57.00
Min. W/S(mil): 2.95/2.95
Min. Hole Size: 0.2mm