Description
Special Request:
1. BGA
2. Impedance Control Board
3. Board Bending: Max. 5%
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 160.00*170.00
Min. W/S(mil): 3.94/3.5
Min. Hole Size: 0.3mm