Description
Special Request:
1. Impedance Control;
2. Plated Through Hole Copper Wall Thickness: Min. 20um,
Average Min. 25um;
3. Solder Mask Thickness on Copper Edge: Min. 5um;
4. Solder Mask Thickness on Copper Surface: Min. 10um.
Layer: 4L
Base Material: FR4 TG≥170, TD≥340(S1000-2M)
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 25.80*35.80
Min. W/S(mil): 5.9/4.27