Description
Special Request:
1. 2 FR4 stiffener on the BOT surface;
2. Stiffener Thickness: 0.8mm;
3. FPC+FR4 Stiffener Thickness: 0.9+/-0.1mm.
Layer: 2L
Base Material: PI
Board Thickness: 0.11mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 62.50*15.00
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.2mm
Solder Mask: Yellow coverlay