Description
Special Request:
1. Outer Layer Final Copper Thickness: Min. 25m
2. Plated Through Hole Copper Wall Thickness: Min. 13um
3. BGA
Layer: 4L
Base Material: FR4 CTI>175
Board Thickness: 0.8mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 75.00*43.00
Min. W/S(mil): 2.5/3.15
Min. Hole Size: 0.15mm