Description
Special Request:
1. Impedance control
2. Plated Through Hole Copper Wall Thickness:
Min. 20um, Average: 25um.
3. Solder Mask Thickness on Copper Edge: Min. 5um,
Solder Mask Thickness on Copper Surface: Min. 10um.
Layer: 4L
Base Material: FR4 TG≥170
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 47.60*47.60
Min W/S(mil): 5/4.26
Min. Hole Size: 0.2mm
Solder Mask: Matte Black