Description
Special Request:
1. Final Copper Thickness: Min. 52.9um;
2. Dielectric Thickness Tolerance: +/-10%;
3. Thermal Conductivity of Dielectric Layer: 1W/m.k;
4. Insulation test with 1000V DC, minimum resistance is 660Ohm.
Layer: 2L
Base Material: FR4+ALU
Board Thickness: 1.70mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 193.00*75.00