Special Request: Solder Mask Thickness: min 10um
Layer: 4L
Base Material: FR4(IT-158)
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 138.00*278.80
Min W/S(mil): 7.87/5.9
Min Hole Size: 0.3mm
