6 Layer High density PCB

Blind&buried Via Board

Layer: 6L

Base Material: FR4 TG170(S1000-2m)

Board Thickness: 1.54mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 90.00*50.00

Min W/S(mil): 3.4/5.37

Min Hole Size: 0.15mm