Special Request:
1. Inner Beveling
2. Solder Mask Thickness: min 10um(Copper Surface)
Layer: 4L
Base Material: FR4 CTI>175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 92.58*113.78
Min Hole Size: 0.3mm
