Description
Special Request:
Holes with 0.1mm(10pcs) under the BGA must be made as Type VII filled & capped Via.
Layer: 2L
Base Material: FR4 TG130
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 9.80*9.80
Min W/S(mil): 6/6
Min Hole Size: 0.1mm