Description
Special Request:
1. Solder Mask Ink Model: H-9100 8G
2. Solder Mask Thickness: ≧10um
3. Outer Final Copper Thickness: min. 52.9um
4. Inner Final Copper Thickness: Min. 55.7um
Layer: 4L
Base Material: FR4 TG150,CTI≧175
Board Thickness: 1.0mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 42.00*92.00
Min W/S(mil): 7.9/7.8
Min Hole Size: 0.2mm