Special Request:
1. Solder Mask Ink Model: H-9100 8G
2. Solder Mask Thickness: ≧10um
Layer: 4L
Base Material: FR4 TG130
Board Thickness: 2.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 170.00*150.36
Min W/S(mil): 7.87/7.87
